Infineon Technologies AGCY7C1474BV33-200BGXCSRAM 芯片
SRAM Chip Sync Octal 3.3V 72M-bit 1M x 72-bit 3ns 209-Pin FBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Obsolete | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| 72M | |
| 1M | |
| 72 | |
| Pipelined | |
| SDR | |
| 20 | |
| 8 | |
| Synchronous | |
| 3 | |
| 200 | |
| 3.135 | |
| 3.3 | |
| 3.6 | |
| 500 | |
| 0 | |
| 70 | |
| Commercial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.26 |
| Package Width | 14 |
| Package Length | 22 |
| PCB changed | 209 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 209 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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