Infineon Technologies AGCY7C1470BV25-200BZXISRAM 芯片
SRAM Chip Sync Quad 2.5V 72M-bit 2M x 36 3ns 165-Pin FBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| 72M | |
| 2M | |
| 36 | |
| Pipelined | |
| SDR | |
| 21 | |
| 4 | |
| Synchronous | |
| 3 | |
| 200 | |
| 2.375 | |
| 2.5 | |
| 2.625 | |
| 450 | |
| -40 | |
| 85 | |
| Industrial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.89 mm |
| Package Width | 15 mm |
| Package Length | 17 mm |
| PCB changed | 165 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 165 | |
| Lead Shape | Ball |
| EDA / CAD Models |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书，掌握系统设计技巧、器件推荐与 AI 洞察，助力高效、安全打造医疗方案。