Infineon Technologies AGCY7C1051H30-10BVXISRAM 芯片
SRAM Chip Async 2.5V/3.3V 8M-bit 512K x 16 10ns 48-Pin VFBGA Tray
| Compliant | |
| 3A991.b.2.b | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| 8M | |
| 512K | |
| 16 | |
| SDR | |
| Asynchronous | |
| 10 | |
| 2.2 | |
| 2.5|3.3 | |
| 3.6 | |
| -40 | |
| 85 | |
| Industrial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.81(Max) mm |
| Package Width | 6 mm |
| Package Length | 8 mm |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 48 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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