Infineon Technologies AGCY62167G30-55BVXESRAM 芯片
SRAM Chip Async Single 2.5V/3V/3.3V 16M-bit 1M x 16 55ns Automotive AEC-Q100 48-Pin VFBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| 8542.32.00.41 | |
| Automotive | Yes |
| PPAP | Unknown |
| 16M | |
| 1M | |
| 16 | |
| SDR | |
| 20 | |
| 1 | |
| Asynchronous | |
| 55 | |
| 65nm | |
| 2.2 | |
| 2.5|3|3.3 | |
| 3.6 | |
| 40 | |
| -40 | |
| 125 | |
| Automotive | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.81(Max) mm |
| Package Width | 6 mm |
| Package Length | 8 mm |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 48 | |
| Lead Shape | Ball |
| EDA / CAD Models |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书，掌握系统设计技巧、器件推荐与 AI 洞察，助力高效、安全打造医疗方案。