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Samsung Electro-MechanicsCL10B104KO8NNNC多层陶瓷电容器
Cap Ceramic 0.1uF 16V X7R 10% Pad SMD 0603 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8532.24.00.20 | |
| Automotive | No |
| PPAP | No |
| 0.1uF | |
| 10% | |
| 16VDC | |
| Low | |
| X7R | |
| Standard | |
| Yes | |
| Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 3.5 | |
| 1.6 X 0.8 X 0.8 | |
| 0603 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.6 | |
| 0.8 | |
| 0.8 | |
| 0.0058 | |
| ±0.1 | |
| ±0.1 | |
| ±0.1 |
| EDA / CAD Models |
设计 AI 驱动的医疗设备
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