| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | 3A001.a.2.c. |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.31.00.60 |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Family Name | Axcelerator |
| Process Technology | 0.15um |
| User I/Os | 248 |
| Number of I/O Banks | 8 |
| Number of Inter Dielectric Layers | 7 |
| Number of Registers | 2816 |
| Operating Supply Voltage (V) | 1.5 |
| Logic Elements | 2816 |
| Device System Gates | 250000 |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 54 |
| Total Number of Block RAM | 12 |
| Device Logic Gates | 154000 |
| Device Logic Units | 2816 |
| Number of Global Clocks | 8 |
| Device Number of DLLs/PLLs | 8 |
| JTAG Support | Yes |
| Programmability | Yes |
| Reprogrammability Support | No |
| Copy Protection | No |
| Opr. Frequency (MHz) | 649 |
| In-System Programmability | No |
| Speed Grade | STD |
| Maximum Propagation Delay Time (ns) | 0.99 |
| Differential I/O Standards | LVPECL|LVDS |
| Single-Ended I/O Standards | LVTTL|LVCMOS |
| Maximum I/O Performance | 700Mbps |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| I/O Voltage (V) | 1.5|1.8|2.5|3.3 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Packaging | Tray |
| Tradename | Axcelerator |
| Mounting | Surface Mount |
| Package Height | 1.73 mm |
| Package Width | 23 mm |
| Package Length | 23 mm |
| PCB changed | 484 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 484 |
| Lead Shape | Ball |
