Syfer Technology222526300392JQTAF9LM多层陶瓷电容器
Cap Ceramic 0.0039uF 630V C0G 5% Pad SMD 2225 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8532.24.00.20 | |
| Automotive | No |
| PPAP | No |
| 0.0039uF | |
| 5% | |
| 630VDC | |
| C0G | |
| Standard | |
| Yes | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 5.7 X 6.3 X 4 | |
| 2225 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 5.7 | |
| 6.3 | |
| 4(Max) |
| EDA / CAD Models |
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