| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 美国海关商品代码 | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | MAX 10 |
| Process Technology | 55nm |
| User I/Os | 178 |
| Operating Supply Voltage (V) | 1.2 |
| Shift Registers | Utilize Memory |
| Logic Elements | 40000 |
| Number of Multipliers | 125 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 1260 |
| Device Logic Units | 40000 |
| Number of Global Clocks | 20 |
| Device Number of DLLs/PLLs | 4 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Speed Grade | 7 |
| Differential I/O Standards | LVDS|SSTL|HSUL |
| External Memory Interface | DDR2 SDRAM|LPDDR2 SDRAM|DDR3 SDRAM|DDR3L SDRAM |
| Minimum Operating Supply Voltage (V) | 1.15 |
| Maximum Operating Supply Voltage (V) | 1.25 |
| I/O Voltage (V) | 1.2|1.35|1.5|1.8|2.5|3|3.3 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Temperature Grade | Industrial |
| Mounting | Surface Mount |
| Package Height | 1.05 |
| Package Width | 17 |
| Package Length | 17 |
| PCB changed | 256 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 256 |
| Lead Shape | Ball |
