Winbond ElectronicsW63CH2MBVABE TRDRAM Chip
DRAM Chip Mobile LPDDR3 SDRAM 4Gbit 128Mx32 1.2V/1.8V 178-Pin VFBGA
| EAR99 | |
| Active | |
| EA | |
| Mobile LPDDR3 SDRAM | |
| 4G | |
| 128Mx32 | |
| 8 | |
| 16M | |
| 32 | |
| 32 | |
| 800 | |
| 5.5 | |
| 17 | |
| HSUL_12 | |
| 1.14|1.7 | |
| 1.3|1.95 | |
| 250 | |
| -25 | |
| 85 | |
| 32 | |
| Mounting | Surface Mount |
| Package Height | 0.67 |
| Package Width | 11 |
| Package Length | 11.5 |
| PCB changed | 178 |
| Supplier Package | VFBGA |
| 178 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.