| 유럽 연합 RoHS 명령어 | Compliant |
| 미국수출통제분류ECCN 인코딩 | EAR99 |
| 친환경 무연 | Active |
| 미국 세관 상품 코드 | 8542.39.00.90 |
| Automotive | No |
| PPAP | No |
| Type | General Purpose |
| Process Technology | CMOS|TTL |
| Number of Channels per Chip | 2 |
| Maximum Data Rate | 50Mbps |
| Maximum Rise Time (ns) | 2(Typ) |
| Maximum Fall Time (ns) | 2(Typ) |
| Maximum Pulse Width Distortion (ns) | 2 |
| Output Type | Logic |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 34 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 34 |
| Maximum Working Insulation Voltage | 566Vp |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Forward/Reverse Channels | 2/0 |
| Minimum Common Mode Rejection (kV/us) | 25 |
| Maximum ESD Protection Voltage (kV) | 1.5@CDM/3@HBM/0.2@MM |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) mm |
| Package Width | 3.98(Max) mm |
| Package Length | 5(Max) mm |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| Pin Count | 8 |
| Lead Shape | Gull-wing |
