| ์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant with Exemption |
| ๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
| ์นํ๊ฒฝ ๋ฌด์ฐ | Active |
| ๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | COMPONENTS |
| SVHC | Yes |
| SVHC ๊ธฐ์ค ์ด๊ณผ | Yes |
| Automotive | No |
| PPAP | No |
| ์ ํ ์นดํ
๊ณ ๋ฆฌ | Power MOSFET |
| Material | Si |
| Configuration | Single |
| Channel Mode | Enhancement |
| Channel Type | P |
| Number of Elements per Chip | 1 |
| Maximum Drain-Source Voltage (V) | 100 |
| Maximum Gate-Source Voltage (V) | ยฑ20 |
| Maximum Gate Threshold Voltage (V) | 4 |
| Operating Junction Temperature (ยฐC) | -55 to 175 |
| Maximum Continuous Drain Current (A) | 14 |
| Maximum Gate-Source Leakage Current (nA) | 100 |
| Maximum IDSS (uA) | 25 |
| Maximum Drain-Source Resistance (mOhm) | 200@10V |
| Typical Gate Charge @ Vgs (nC) | 58(Max)@10V |
| Typical Gate Charge @ 10V (nC) | 58(Max) |
| Typical Gate to Drain Charge (nC) | 32(Max) |
| Typical Gate to Source Charge (nC) | 8.3(Max) |
| Typical Reverse Recovery Charge (nC) | 650 |
| Typical Input Capacitance @ Vds (pF) | 760@25V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 170@25V |
| Minimum Gate Threshold Voltage (V) | 2 |
| Typical Output Capacitance (pF) | 260 |
| Maximum Power Dissipation (mW) | 3800 |
| Typical Fall Time (ns) | 46 |
| Typical Rise Time (ns) | 58 |
| Typical Turn-Off Delay Time (ns) | 45 |
| Typical Turn-On Delay Time (ns) | 15 |
| Minimum Operating Temperature (ยฐC) | -55 |
| Maximum Operating Temperature (ยฐC) | 175 |
| Packaging | Tape and Reel |
| Maximum Pulsed Drain Current @ TC=25ยฐC (A) | 56 |
| Maximum Junction Ambient Thermal Resistance on PCB (ยฐC/W) | 40 |
| Typical Gate Plateau Voltage (V) | 6 |
| Maximum Diode Forward Voltage (V) | 1.6 |
| Maximum Positive Gate-Source Voltage (V) | 20 |
| Mounting | Surface Mount |
| Package Height | 4.83(Max) mm |
| Package Width | 9.65(Max) mm |
| Package Length | 10.67(Max) mm |
| PCB changed | 2 |
| Tab | Tab |
| Standard Package Name | TO |
| Supplier Package | D2PAK |
| Pin Count | 3 |
| Lead Shape | Gull-wing |
