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W25Q256JWFIQ|WINBOND|simage
W25Q256JWFIQ|WINBOND|limage
Flash

W25Q256JWFIQ

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 256M-bit 32M x 8 6ns 16-Pin SOIC W Tube

Winbond Electronics
Fiches techniques 

Spécifications techniques du produit
  • RoHS (Unión Europea)
    Compliant
  • ECCN (Estados Unidos)
    3A991b.1.a.
  • Estatus de pieza
    Active
  • Código HTS
    8542.32.00.51
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    256M
  • Architecture
    Sectored
  • Boot Block
    No
  • Block Organization
    Symmetrical
  • Address Width (bit)
    32
  • Sector Size
    4Kbyte x 8192
  • Page Size
    256byte
  • Number of Bits/Word (bit)
    8
  • Number of Words
    32M
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    6
  • Maximum Erase Time (s)
    400/Chip
  • Maximum Programming Time (ms)
    5/Page
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    1.7
  • Maximum Operating Frequency (MHz)
    133
  • Typical Operating Supply Voltage (V)
    1.8
  • Maximum Operating Supply Voltage (V)
    1.95
  • Programming Voltage (V)
    1.7 to 1.95
  • Operating Current (mA)
    20
  • Program Current (mA)
    20
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Packaging
    Tube
  • Mounting
    Surface Mount
  • Package Height
    2.31
  • Package Width
    7.49
  • Package Length
    10.31
  • PCB changed
    16
  • Standard Package Name
    SO
  • Supplier Package
    SOIC W
  • Pin Count
    16
Quantité de commande

Documentation et ressources

Fiches techniques
Ressources de conception