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SI7414DNT1GE3|VISHAY|limage
SI7414DNT1GE3|VISHAY|simage
MOSFET

SI7414DN-T1-GE3

Trans MOSFET N-CH 60V 5.6A 8-Pin PowerPAK 1212 EP T/R

Vishay
Fiches techniques 

Spécifications techniques du produit
  • 유럽 연합 RoHS 명령어
    Compliant
  • 미국수출통제분류ECCN 인코딩
    EAR99
  • 친환경 무연
    Obsolete
  • 미국 세관 상품 코드
    8541.29.00.95
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Configuration
    Single Quad Drain Triple Source
  • Channel Mode
    Enhancement
  • Channel Type
    N
  • Number of Elements per Chip
    1
  • Maximum Drain-Source Voltage (V)
    60
  • Maximum Gate-Source Voltage (V)
    ±20
  • Maximum Gate Threshold Voltage (V)
    3
  • Operating Junction Temperature (°C)
    -55 to 150
  • Maximum Continuous Drain Current (A)
    5.6
  • Maximum Gate-Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    1
  • Maximum Drain-Source Resistance (mOhm)
    25@10V
  • Typical Gate Charge @ Vgs (nC)
    16@10V
  • Typical Gate Charge @ 10V (nC)
    16
  • Typical Gate to Drain Charge (nC)
    4.4
  • Typical Gate to Source Charge (nC)
    2.7
  • Minimum Gate Threshold Voltage (V)
    1
  • Typical Output Capacitance (pF)
    100
  • Maximum Power Dissipation (mW)
    3800
  • Typical Fall Time (ns)
    12
  • Typical Rise Time (ns)
    12
  • Typical Turn-Off Delay Time (ns)
    30
  • Typical Turn-On Delay Time (ns)
    15
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Packaging
    Tape and Reel
  • Typical Drain-Source Resistance @ 25°C (mOhm)
    30@4.5V|21@10V
  • Maximum Power Dissipation on PCB @ TC=25°C (W)
    3.8
  • Maximum Pulsed Drain Current @ TC=25°C (A)
    30
  • Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
    81
  • Typical Diode Forward Voltage (V)
    0.75
  • Typical Gate Plateau Voltage (V)
    3.8
  • Typical Reverse Recovery Time (ns)
    45
  • Maximum Diode Forward Voltage (V)
    1.2
  • Maximum Positive Gate-Source Voltage (V)
    20
  • Maximum Continuous Drain Current on PCB @ TC=25°C (A)
    8.7
  • Mounting
    Surface Mount
  • Package Height
    1.07(Max)
  • Package Width
    3.05
  • Package Length
    3.05
  • PCB changed
    8
  • Supplier Package
    PowerPAK 1212 EP
  • Pin Count
    8
  • Lead Shape
    No Lead

Documentation et ressources

Fiches techniques
Ressources de conception