Spécifications techniques du produit
유럽 연합 RoHS 명령어
Compliant
미국수출통제분류ECCN 인코딩
3A991.b.1.a
친환경 무연
Active
미국 세관 상품 코드
8542.32.00.71
Automotive
Unknown
PPAP
Unknown
Cell Type
NAND
Chip Density (bit)
64G
Architecture
Sectored
Boot Block
Yes
Programmability
Yes
Timing Type
Synchronous
Interface Type
Serial e-MMC
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Extended
Command Compatible
No
ECC Support
No
Support of Page Mode
No
Packaging
Tray
Mounting
Surface Mount
Package Height
0.48
Package Width
11.5
Package Length
13
PCB changed
153
Standard Package Name
BGA
Supplier Package
TFBGA
Pin Count
153
Lead Shape
Ball

