Fuses

C1T 4

Fuse Chip Slow Blow Acting 4A 63V SMD Solder Pad 1206 3.2 X 1.58 X 0.63mm Ceramic TUV/UL/cUL Automotive AEC-Q200

Bel

Spécifications techniques du produit

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8536.10.00.40

• Automotive

  Yes

• PPAP

  Unknown

• Type

  Chip

• Acting

  Slow Blow

• Application

  Industrial Equipment|LCD Monitor|Medical Equipment|Notebook|Office Electronic Equipment|Power Supply

• Fuse Size (mm)

  3.2 X 1.58 X 0.63

• Current Rating (A)

  4

• Maximum Voltage Rating (V)

  63

• Maximum AC Voltage Rating (V)

  63

• Maximum DC Voltage Rating (V)

  63

• Maximum Power Dissipation (W)

  0.78

• Breaking Capacity @ Rated Voltage (A)

  50@63VAC|50@63VDC

• Typical Melting I2t (A²S)

  2.56

• Typical Cold Resistance (Ohm)

  0.03

• Termination Style

  Solder Pad

• Number of Terminals

  2

• Minimum Operating Temperature (°C)

  -55

• Maximum Operating Temperature (°C)

  125

• Packaging

  Tape and Reel

• Product Depth (mm)

  1.58

• Product Length (mm)

  3.2

• Product Height (mm)

  0.63

• Fuse Material

  Ceramic

• Mounting

  Surface Mount

• Package/Case

  1206