| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | LTB |
| Código HTS | 8542.32.00.24 |
| DRAM Type | RLDRAM3 |
| Chip Density (bit) | 1.125G |
| Organization | 32Mx36 |
| Number of Internal Banks | 16 |
| Number of Words per Bank | 2M |
| Number of Bits/Word (bit) | 36 |
| Data Bus Width (bit) | 36 |
| Maximum Clock Rate (MHz) | 1200 |
| Address Bus Width (bit) | 24 |
| Minimum Operating Supply Voltage (V) | 1.28 |
| Maximum Operating Supply Voltage (V) | 1.42 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 36 |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.7(Min) |
| Package Width | 13.5 |
| Package Length | 13.5 |
| PCB changed | 168 |
| Supplier Package | BGA |
| Pin Count | 168 |
