| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | EA |
| DRAM Type | DDR3L SDRAM |
| Chip Density (bit) | 4G |
| Organization | 512Mx8 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 64M |
| Number of Bits/Word (bit) | 8 |
| Data Bus Width (bit) | 8 |
| Maximum Clock Rate (MHz) | 2133 |
| Maximum Access Time (ns) | 0.18 |
| Address Bus Width (bit) | 19 |
| Process Technology | 20nm |
| Minimum Operating Supply Voltage (V) | 1.283 |
| Maximum Operating Supply Voltage (V) | 1.45 |
| Operating Current (mA) | 110 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 8 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 1.26 - 0.29(Min) mm |
| Package Width | 8 mm |
| Package Length | 10.5 mm |
| PCB changed | 78 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 78 |