NXP SemiconductorsMC33FS6600M0ESInterfaces especializadas
Plastic Thermal Enhanced Interface Automotive AEC-Q100
| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.90 | |
| SVHC | Yes |
| Automotive | Yes |
| PPAP | Yes |
| System Basis Chip | |
| SPI | |
| 2.7 | |
| 60 | |
| -40 | |
| 125 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.95(Max) mm |
| Package Width | 8 mm |
| Package Length | 8 mm |
| PCB changed | 56 |
| Standard Package Name | QFN |
| Supplier Package | HVQFN EP |
| 56 | |
| Lead Shape | No Lead |
| EDA / CAD Models |
Dispositivos médicos alimentados por IA
Libro blanco Arrow: consejos e información sobre IA para el diseño de soluciones de diagnóstico y terapia rápidas y seguras.