| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.90 |
| Automotive | Yes |
| PPAP | Yes |
| Type | General Purpose |
| Number of Channels per Chip | 2 |
| Maximum Data Rate | 50Mbps |
| Maximum Rise Time (ns) | 5.3 |
| Maximum Fall Time (ns) | 5.3 |
| Minimum Pulse Width (ns) | 20 |
| Maximum Pulse Width Distortion (ns) | 8.2 |
| Output Type | CMOS|LVCMOS |
| Maximum Operating Supply Voltage (V) | 1.89|5.5 |
| Minimum Operating Supply Voltage (V) | 1.71|2.25 |
| Maximum Propagation Delay Time (tPHL) (ns) | 24 |
| Minimum Isolation Voltage (Vrms) | 3000 |
| Maximum Propagation Delay Time (tPLH) (ns) | 24 |
| Maximum Working Insulation Voltage | 637Vp |
| Maximum Output Current Drive (mA) | 15 |
| Maximum Power Dissipation (mW) | 73 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
| Forward/Reverse Channels | 1/1 |
| Minimum Common Mode Rejection (kV/us) | 100 |
| Supplier Temperature Grade | Automotive |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 3.9 |
| Package Length | 4.91 |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| Pin Count | 8 |
