| RoHS (Unión Europea) | Compliant with Exemption |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8541.29.00.95 |
| SVHC | Yes |
| Índice de SEP por encima del límite autorizado | Yes |
| Automotive | No |
| PPAP | No |
| Categoría del producto | Power MOSFET |
| Material | Si |
| Configuration | Single Quad Drain Triple Source |
| Process Technology | NexFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain-Source Voltage (V) | 40 |
| Maximum Gate-Source Voltage (V) | ±20 |
| Maximum Gate Threshold Voltage (V) | 2.4 |
| Maximum Continuous Drain Current (A) | 100 |
| Maximum Gate-Source Leakage Current (nA) | 100 |
| Maximum IDSS (uA) | 1 |
| Maximum Drain-Source Resistance (mOhm) | 3.4@10V |
| Typical Gate Charge @ Vgs (nC) | 23@4.5V|45@10V |
| Typical Gate Charge @ 10V (nC) | 45 |
| Typical Gate to Drain Charge (nC) | 8.8 |
| Typical Input Capacitance @ Vds (pF) | 3300@20V |
| Maximum Power Dissipation (mW) | 3100 |
| Typical Fall Time (ns) | 4 |
| Typical Rise Time (ns) | 12 |
| Typical Turn-Off Delay Time (ns) | 21 |
| Typical Turn-On Delay Time (ns) | 6 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Packaging | Tape and Reel |
| Typical Gate Threshold Voltage (V) | 1.8 |
| Mounting | Surface Mount |
| Package Height | 1 |
| Package Width | 5.75 |
| Package Length | 4.9 |
| PCB changed | 8 |
| Standard Package Name | SON |
| Supplier Package | VSONP EP |
| Pin Count | 8 |
