Introduction to Qualcomm® RB3 Gen 2 development kit
Delivering advanced on-device AI for enterprise and industrial applications, the Qualcomm RB3 Gen 2 IoT development kit, powered by the Qualcomm® QCS6490 processor, offers high-performance computing, accessibility, and cutting-edge features. Developers can utilize extensive customization with the Qualcomm RB3 Gen 2 Lite, which is powered by the Qualcomm® QCS5430 processor to provide scalable CPU, GPU, AI, and camera capabilities via feature pack options. Available as either Core Kits or Vision Kits, these development kits are purpose-built for industrial and commercial IoT use. Both boards feature pin-to-pin compatible SOMs, identical peripheral interfaces, and a unified software stack.
Benefits
Connectivity
With 802.11ax and Bluetooth® 5.2, enjoy enhanced connection speed, reliability, range, and data transfer, optimizing wireless communication between devices and peripherals.
On-Board Artificial Intelligence
Depending on the platform selected, advanced edge AI processing delivers up to 12 TOPs, enabling faster and more power-efficient execution of AI algorithms.
Performance
Offering a variety of CPU and GPU options across the Qualcomm RB3 Gen 2 and Qualcomm RB3 Gen 2 Lite platforms, your IoT solutions benefit from heterogeneous computing with integrated audio, ISP, and AI subsystems. The product longevity program offers long-term reliability with extended support.
Expansion Connectors
The development kits provide access to various I/O interfaces on the SoCs through standard expansion connectors. High-speed connectors, such as PCIE and MIPI CSI, enable smooth integration with peripheral devices requiring high data rates, while low-speed connectors support GPIOs, UART, SPI, I2C, I2S, and more.
Scalable Hardware Architecture
Easily prototype by stacking additional mezzanine boards with passthrough connectors, expanding functionality with options like 5G connectivity, extra sensors, cameras, and more. The Vision Mezzanine follows the same stacked architecture, offering additional MIPI CSI and GMSL camera connectors.
Pre-Integrated with Multiple Sensors
The platform comes with pre-integrated sensors and drivers for camera and motor control functions. A dedicated DSP shared between the sensor core and low-power audio subsystem boosts performance and efficiency, making it perfect for IoT applications.
Software Support
The development kits come preloaded with the Qualcomm® Linux® software stack. Developers can access additional SDKs for cross-compilation toolchains, robotics algorithms, TensorFlow Lite, GStreamer plugins, and middleware such as the Robot Operating System (ROS).
Camera and Computer Vision
Based on the selected platform, developers can utilize up to three concurrent cameras to create advanced computer vision applications.
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