Arrow MultiSolution Day Poland 2025
We are delighted to invite you to the MultiSolution Day, an event dedicated to showcasing the latest advancements in microelectronics, smart infrastructure and innovative technologies. This unique gathering is an opportunity to explore cutting-edge solutions, network with industry experts, and exchange ideas that shape the future of technology.
Event Details:
Date: 12 June 2025
Time: 9:00 – 18:00
Location: Centrum Olimpijskie, Wybrzeże Gdyńskie 4, Warszawa
Number of Exhibitors: 40+
Why Attend?
- Learn from industry leaders and experts.
- Discover the newest technology trends across Cyber Security, AI and more.
- Network with innovators and professionals in electronics and smart solutions.
- Enjoy a hilarious Niebezpiecznik’s lecture and relax closing grill event.
Lunch and coffee breaks will be provided throughout the event for your convenience.
Don’t miss out – register today to secure your spot!
We look forward to welcoming you to an inspiring day full of innovation and discovery
Agenda:
Track 1 |
Track 2 |
|
| 08.30 - 09.00 |
Registration |
|
| 09.15 - 10.00 |
Technology Insight - AI & Cyber Resilience Join George for his insights on AI & Cyber Resilience. For AI he will explore multimodal and mutli-model AI similar sounding terms with very different meanings; and for cyber security he will share pragmatic ideas for cyber resilient product design. Presenter: George Dickey |
|
| 10.00 - 10.45 |
INFINEONDriving BLDC using PsoC microcontroller with use of GaN transistorsPractical implementations of BLDC motor control systems based on the latest family of PsoC C3 (Control) micro with a power stage on GaN. Focus on the technical aspects of such a set of components and the benefits resulting from the use of the latest technologies. Presenter: Tomasz Kowalczyk |
NEXPERIAPowering the Future, Beyond Commodities: Nexperia's New Era in High-Performance Power DevicesLearn about Nexperia's strategic transition from commodity components to advanced power solutions. Explore Nexperia's latest products, including Silicon Carbide (SiC) MOSFETs, Gallium Nitride (GaN) FETs, IGBTs and Power Management ICs. Discover how these cutting-edge technologies can enhance efficiency and performance across various applications, from renewable energy to automotive and from power to industrial automation. Presenter: Marco Scilio, FAE Team Leader |
| 10.45 - 11.00 |
COFFEE BREAK |
|
| 11.00 - 11.45 |
NXPFrom Regulation to Resilience: How NXP Supports CRA-Ready DesignsWith AI/ML at the edge, it is available to build solutions making decisions in real time without the latency and bandwidth challenges introduced by the cloud. Such architecture brings additional security threats to embedded application. NXP offers EdgeLock technology included in comprehensive portfolio of MCUs and processors. Presenter: Manar Ouatouf i Yashas Bedre |
AlteraSzybka ścieżka do AI z FPGA: ALTERA FPGAiZobacz które cechy nowych układów FPGA Altera pozwalają na efektywną realizację nowoczesnych rozwiązań Sztucznej Inteligecji. Zrozum proces nauczania i inferencji sieci neuronowych na układach Altera FPGA za wykorzystaniem FPGA AI Suite. Poznaj materiały i przykłady, dzięki którym szybko wejdziesz w świat AI z FPGA. Presenter: Tomasz Iwański |
| 11.45 - 12.00 |
COFFEE BREAK |
|
| 12.00 - 12.45 |
TESmart Infrastructure for BESS and EVIDiscover the future of smart infrastructure—from battery storage and EV charging to climate solutions that power a greener, more resilient world. Stay ahead with innovative energy solutions! Presenter: Ganesh Manikandan |
STMRED & CRA - Impacts and ways to compilance and new STM32 wireless MCU portfolioThe lecture covers the impact of RED (Radio Equipment Directive) & CRA (Cyber Resilience Act) on device design and the ways to ensure compliance with new regulatory requirements. Additionally, it will present the latest STM32 wireless MCU portfolio, enabling innovative IoT solutions Presenters: Mariusz Paleczny & Szymon Panecki |
| 12.45 - 13.45 |
LUNCH BREAK |
|
| 13.45 - 14.30 |
3M3M Interconnect Application Profiles3M's interconnect solutions are designed to meet the evolving needs of various industries by providing innovative, reliable, and high-performance products. The extensive product portfolio includes cables, connectors, and assemblies that offer durability, flexibility, and ease of use. Whether for machine vision, data centers, industrial automation, or sensor and signal applications, 3M's interconnect solutions deliver the performance and reliability required for today's demanding environments. Presenter: Petr Kadlecek |
MicrochipCyber Resilience Act (CRA)Microchip Value Propositions How to Secure IoT and Industrial applications for CRA. Presenter: Miroslaw Dybizbanski |
| 14.30 - 14.45 |
COFEE BREAK |
|
| 14.45 - 15.45 |
NiebezpiecznikJak zhackować dom i firmę przyszłość? Czyli ataki na Internet Rzeczy (IoT)Żyjemy w świecie, w którym wszystko jest połączone. Jeśli nie wprost do internetu, to bezpośrednio ze sobą. W ramach tej prelekcji pokażemy jak wygoda Internetu Rzeczy (IoT) może -- na skutek różnych ataków i błędów projektowych -- przerodzić się w koszmar. Brak usług, straty finansowe, ale także śmierć. Pokażemy jak korzystać z nowych technologii w bezpieczny sposób, tak aby ograniczać ryzyka, na które nas narażają. Podejrzymy ludzi przez kamerki, ustalimy co słyszy telewizor i ile informacji na nasz temat może mieć "głupia lodówka", firmowa drukarka, inteligentny termostat czy zwykły samochód, z którego na co dzień korzystamy, a nie zawsze wiemy, że jest stale podłączony do internetu. |
|
| 15:50 |
CustomersAwards ceremony for the most active Customer. |
SuppliersAwards ceremony for the most active Supplier. |
| 16.10 |
GRILL |
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