Infineon’s EasyPACK™ Module with CoolSiC™ Trench MOSFET and PressFIT/NTC

Infineon’s F3L11MR12W2M1_B65 is the new 11 mΩ 3-level module with CoolSiC™ MOSFET, NTC, and PressFIT Contact Technology. It extends Infineon’s EasyPACK™ 2B family with a 3-level Active Neutral Point Clamped (ANPC) topology. The modules are ideal for high-frequency switching, solar, and 3-level applications.

The EasyPACK™ 2B module F3L11MR12W2M1_B65 offers full 1500 Vdc capability with 1200 V switches at a maximum efficiency of 99.2%, high current density, as well as best-in-class switching and conduction losses. Customers see an advantage to using silicon carbide as opposed to other solutions such as SiC 5-level topologies: the reduced number of switches used in the SiC 3-level topology leads to a reduced risk of field failures.

LEARN MORE

See related product

F3L11MR12W2M1B65BOMA1

Infineon Technologies AG IGBT Modules View

 

 

 

 

Related news articles

Latest News

Sorry, your filter selection returned no results.

We've updated our privacy policy. Please take a moment to review these changes. By clicking I Agree to Arrow Electronics Terms Of Use  and have read and understand the Privacy Policy and Cookie Policy.

Our website places cookies on your device to improve your experience and to improve our site. Read more about the cookies we use and how to disable them here. Cookies and tracking technologies may be used for marketing purposes.
By clicking “Accept”, you are consenting to placement of cookies on your device and to our use of tracking technologies. Click “Read More” below for more information and instructions on how to disable cookies and tracking technologies. While acceptance of cookies and tracking technologies is voluntary, disabling them may result in the website not working properly, and certain advertisements may be less relevant to you.
We respect your privacy. Read our privacy policy here