Infineon’s EasyPACK™ Module with CoolSiC™ Trench MOSFET and PressFIT/NTC

Infineon’s F3L11MR12W2M1_B65 is the new 11 mΩ 3-level module with CoolSiC™ MOSFET, NTC, and PressFIT Contact Technology. It extends Infineon’s EasyPACK™ 2B family with a 3-level Active Neutral Point Clamped (ANPC) topology. The modules are ideal for high-frequency switching, solar, and 3-level applications.

The EasyPACK™ 2B module F3L11MR12W2M1_B65 offers full 1500 Vdc capability with 1200 V switches at a maximum efficiency of 99.2%, high current density, as well as best-in-class switching and conduction losses. Customers see an advantage to using silicon carbide as opposed to other solutions such as SiC 5-level topologies: the reduced number of switches used in the SiC 3-level topology leads to a reduced risk of field failures.


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