Gordon Moore’s prescient prediction of the ever-growing density of components on integrated circuits (ICs) continues to be proved right. Even if the recent growth is slowing down, the trend towards smaller packages continues apace.
Of course, the journey towards miniaturization has been driven over the decades by the need to pack more functionality and capability into less space, which is especially important with the increasing numbers of “wearable” and mobile devices. More recently, there is an emergence of the Internet of Things (IoT), the Industrial Internet of Things (IIoT), and the virtually insatiable demand for high-performance devices with tiny footprints.
Supplying semiconductor components in packaged form not only protects the die inside but also provides a more convenient way of handling the components and using them in automated manufacturing processes. Read this paper from Diodes Incorporated to learn about the vast range of small outline packages (SOPs) on the market, including the very small outline package (VSOP), which typically measures between 3mm and 10mm in body width and 1.2mm to 1.25mm in height.
By taking up minimal space on a PCB, the compactness of all these components – and an extensive range of others from Diodes – means that designers of mobile electronics products can be confident that maximum system performance can still be delivered without compromising on form-factor.
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