AIROC™ Wi-Fi 6/6E & Bluetooth® 5

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AIROC™ CYW5557x with Laird Sona™ IF573 WiFi 6E + Bluetooth® 5.4 Module

AIROC™ CYW5557x Wi-Fi 6E tri-band and Bluetooth® 5 SoCs


AIROC CYW5557X WiFi 6E tri-band

Infineon’s AIROC™ CYW5557x is a highly integrated Wi-Fi 6 / 6E and Bluetooth® 5.3 SoC family. Supporting Wi-Fi 6 / 6E features with Tri-band (2.4GHz, 5GHz, 6GHz) capability, the CYW5557x is available in both 1x1 single-input, single-output (SISO) and 2x2 multiple-input, multiple-output (MIMO) configurations. The SoC brings exceptional high-quality video/audio streaming and a seamless gaming experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.

This chip provides the technical benefits of Wi-Fi 6 – including increased communications range and robustness as well as increased battery life. It is also the first IoT Wi-Fi chip with Wi-Fi 6E support, allowing leading products access to the uncongested 6 GHz spectrum.

Key benefits

  • Extreme low latency from greenfield 6 GHz bands and virtual simultaneous dual band feature for seamless audio and video streaming
  • Range boost to ensure devices stay connected to remote access point
  • Enhanced network robustness features to ensure the best streaming of video/audio in congested or overlapping network environments
  • Advanced power saving features to maximize battery life
  • Network offload to offload host processing power and save system power consumption
  • Multi-layer security for protection of individual subsystems through whole product life-cycle
  • Best-in-class Bluetooth® receive sensitivity and multiple optimized transmission options of 0 dbm, 13dbm, and 20dbm of output power for various applications
  • AIROC™ Bluetooth® Stack and example code to shorten Bluetooth® development cycle
  • Shorten time-to-market with globally certified module partners
  • Wi-Fi support in the Infineon Developer Community with direct access to online applications support engineers

Applications

  • Surveillance camera
  • Smart speaker
  • Voice assistance system
  • AR/VR
  • Digital camera
  • Security system
  • Industrial gateway
  • AI enabled applications
  • Gaming

Wi-Fi Features

  • Wi-Fi 6/6E, Tri-band (2.4/5/6 GHz)
  • OFDMA, MU-MIMO, TWT, DCM
  • 2x2 MIMO or 1x1 SISO
  • 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate
  • STA and Soft AP mode
  • Enhanced range, power savings, network efficiency features
  • Zero-wait TWT

Bluetooth® Features

  • Bluetooth® 5.3 certified
  • Bluetooth® 5.2, 5.1, 5.0: All optional features
  • LE Audio and Auracast™ Broadcast Audio
  • LE- 2Mbps, Long Range , Advertising Extensions
  • SCO and eSCO
  • Complies with Bluetooth® core specification version 5.2
  • 20 dBm, 13 dBm, and 0 dBm TX path to optimize range and/or minimize power consumption
  • Best in class receive sensitivity up to -110.5 dBm

Coexistence

  • Built-in advanced Bluetooth/WLAN Coex
  • 2-wire SECI for external Coex
  • Bluetooth/GPS/LTE radio

Laird Sona™ IF573 WiFi 6E + Bluetooth® 5.4 Module


Laird Sona IF573 WiFi 6E and Bluetooth 54 Module

Details:

  • Wireless Specification: 2x2 Wi-Fi 6E and 1x1 Bluetooth 5.4
  • Frequency: 2.4, 5, and 6 GHz (up to 7.125 GHz)
  • Chipset: Infineon AIROC™ CYW55573
  • Antenna options: RF Antenna Pin / On-board MHF4 Connector
  • Certifications: FCC, IC, CE, MIC, RCM, Bluetooth SIG
  • Data Rate: Up to 574 Mbps @ 2.4 GHz; Up to 1.2 Gbps @ 5/6 GHz
  • Form Factors: M.2 1318 SMT & M.2 2230 Key E Pluggable
  • Interfaces: PCIE v3.0 Gen 2 (Wi-Fi) and HCI using HS-UART (BT); SDIO 3.0 (Wi-Fi) and HCI using HS-UART (BT)
  • Operating Temp: -40 °C - +85 °C

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Laird Development Kit, Sona IF573

Laird Development Kit Sona IF573

The Sona IF573 Development Kit developed by Laird is designed for evaluation of the Sona IF573 module.

Features:

  • MIMO, M.2, Key E, SDIO, UART

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product brief

datasheet

Embedded Artists 2EA M.2 Module Eval Board


Embedded Artusts 2EA M2 Module Eval Board

The 2EA M.2 module, co-developed by Embedded Artists and Murata, is designed for evaluation, integration, and ease-of-use. The integration guide helps integrate an M.2 module into embedded designs and contains information about the M.2 standard and reference schematics.

Features

  • Wi-Fi 6E, 802.11 a/b/g/n/ac/ax 2x2 MIMO
  • Bluetooth® 5.2 BR/EDR/LE
  • PCIe interface, in M.2 form factor (22 x 44 mm)
  • Chipset: Infineon AIROC™ CYW55573

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Datasheet

M.2 Integration guide

Murata Type 2EA Module for AIROC™ CYW55573


Murata Type 2EA Module for AIROC

Datasheet


Details

  • Part number: LBEE5XV2EA-802
  • Wi-Fi/Bluetooth® Support: 2.4/5 and 6 GHz, 802.11a/b/g/n/ac/ax MIMO, Bluetooth®/Bluetooth® LE
  • WLAN Stream: 2T2R
  • Area: 12.5x9.4
  • Regulatory: CE/FCC/IC/TELEC
  • Linux: yes
  • Interfaces: WLAN - PCIe/SDIO; Bluetooth®: UART/PCM
  • Highlights: 2x2 MIMO 11ac + Bluetooth® solution (Bluetooth® 5.3) Support Wi-Fi 6E (6 GHz), -40°C to +85°C"

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Additional Resources

Linux WiFi Driver Releases on Infineon Developer Community


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