Winbond ElectronicsW71NW10GE3FWMulti-Chip Package Memory
MCP 1.8V 1Gb NAND Flash and 512Mb DRAM
| Compliant | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 1G | |
| 512M | |
| Yes | |
| 1.7 | |
| 1.95 | |
| -40 | |
| 85 | |
| Mounting | Surface Mount |
| Package Height | 1 |
| Package Width | 8 |
| Package Length | 10.5 |
| EDA / CAD Models |
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