Winbond ElectronicsW66BQ6NBHAGJDRAM Chip
DRAM Chip Mobile LPDDR4X SDRAM 2Gbit 128Mx16 1.1V/1.8V 100-Pin VFBGA
| Compliant | |
| EAR99 | |
| LTB | |
| Mobile LPDDR4X SDRAM | |
| 2G | |
| 128Mx16 | |
| 8 | |
| 16M | |
| 16 | |
| 16 | |
| 3733 | |
| 3.5 | |
| 17 | |
| LVSTL | |
| 1.06|1.7 | |
| 1.17|1.95 | |
| 345 | |
| -40 | |
| 105 | |
| 16 | |
| Mounting | Surface Mount |
| Package Height | 0.62 |
| Package Width | 7.5 |
| Package Length | 10 |
| PCB changed | 100 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 100 |
| EDA / CAD Models |
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