| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.90 | |
| SVHC | Yes |
| Automotive | Yes |
| PPAP | Yes |
| Low Side | |
| Non-Inverting | |
| 2 | |
| IGBT|MOSFET | |
| 2 | |
| 40 | |
| 40 | |
| 35(Typ) | |
| CMOS|TTL | |
| 4 | |
| 15 | |
| 0.8 | |
| 2.7 | |
| 2.2 | |
| 4(Typ) | |
| 2.2|30 | |
| 655 | |
| -40 | |
| 125 | |
| Automotive | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) mm |
| Package Width | 3.98(Max) mm |
| Package Length | 5(Max) mm |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| 8 | |
| Lead Shape | Gull-wing |
Efficiency is important when designing any electronic circuit. The UCC27324QDRQ1 power driver from Texas Instruments ensures that proper power management is enforced. This device has a maximum propagation delay time of 35(typ) ns and a maximum power dissipation of 655 mW. Its maximum power dissipation is 655 mW. In order to ensure safe delivery and enable quick mounting of this component after delivery, it will be encased in tape and reel packaging during shipment. This gate driver has a minimum operating temperature of -40 °C and a maximum of 125 °C. This device has a minimum operating supply voltage of 4 V and a maximum of 15 V.
| EDA / CAD Models |
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