Infineon Technologies AGS78HS512TC0BHB013Multi-Chip Package Memory
MCP 64Mx8 Flash + 8Mx8 PSRAM 1.8V Automotive 24-Pin FBGA T/R
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| 512M | |
| 64M | |
| 64Mx8 Flash + 8Mx8 PSRAM | |
| 1.7 | |
| 2 | |
| -40 | |
| 105 | |
| Automotive | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) - 0.2(Min) mm |
| Package Width | 8 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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