Infineon Technologies AGS76HL512TC0BHB000Multi-Chip Package Memory
MCP 64Mx8 Flash + 8Mx8 PSRAM 3V/3.3V Automotive AEC-Q100 24-Pin FBGA Tray
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| 512M | |
| 64M | |
| 64Mx8 Flash + 8Mx8 PSRAM | |
| 2.7 | |
| 3.6 | |
| -40 | |
| 105 | |
| Automotive | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) - 0.2(Min) mm |
| Package Width | 8 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
Design AI-powered medical devices
Explore system design tips, part recs and AI insights to help you build faster, safer diagnostic and therapy solutions—all in Arrow’s latest white paper.