Infineon Technologies AGS70FS01GSDSBHV213Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 1G/512M/256M x 1/2-bit/4-bit 8ns 24-Pin FBGA T/R Automotive AEC-Q100
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| NOR | |
| 1G | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 256Kbyte x 512 | |
| 256byte|512byte | |
| 1/2/4 | |
| 1G/512M/256M | |
| Yes | |
| Synchronous | |
| 8 | |
| 720/Bulk | |
| 2/Page | |
| 65nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 | |
| 80 | |
| 1.8 | |
| 2 | |
| 1.7 to 2 | |
| 100 | |
| 100 | |
| -40 | |
| 105 | |
| Industrial Plus | |
| Yes | |
| Yes | |
| No | |
| 100000 | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) - 0.2(Min) mm |
| Package Width | 6 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
Design AI-powered medical devices
Explore system design tips, part recs and AI insights to help you build faster, safer diagnostic and therapy solutions—all in Arrow’s latest white paper.