Infineon Technologies AGS25FS256SAGBHI200Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns 24-Pin BGA Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 256M | |
| Sectored | |
| No | |
| Symmetrical | |
| 32 | |
| 64Kbyte x 512|256Kbyte x 128 | |
| 256byte|512byte | |
| 1/2/4 | |
| 256M/128M/64M | |
| Yes | |
| Synchronous | |
| 8 | |
| 360/Chip | |
| 2/Page | |
| 65nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 | |
| 1.8 | |
| 2 | |
| 1.7 to 2 | |
| 100 | |
| 100 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| 100000 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) - 0.2(Min) mm |
| Package Width | 6 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.