Infineon Technologies AGS25FL512SAGBHI210Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 512M/256M/128M x 1/2-bit/4-bit 14.5ns 24-Pin BGA Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 512M | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 256Kbyte x 256 | |
| 512byte | |
| 1/2/4 | |
| 512M/256M/128M | |
| Yes | |
| Synchronous | |
| 14.5 | |
| 460/Bulk | |
| 0.75/Page | |
| 65nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 133 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 100 | |
| 100 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| 100000 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) - 0.2(Min) mm |
| Package Width | 6 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.