QUALCOMMQCS-605-0-771PSP-MT-01-0-ACApplication Processors and SOCs

Qualcomm® QCS605 Application Processor

10nm SoC purpose-built to deliver high-performing, power-efficient edge computing for next-generation smart cameras and smart home applications with an octa-core CPU and 4K video capture.

The QCS605 SoC is a high performance IoT System-on-Chip (SoCs) that incorporates key features for building advanced use cases encompassing machine learning, edge computing, sensor processing, voice UI enablement and integrated wireless connectivity.

The 10nm QCS605 SoC is engineered to deliver powerful computing for on-device camera processing and machine learning, with exceptional power and thermal efficiency, across a wide range of IoT applications. It integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous compute architecture including highly optimized custom CPU, GPU and DSP.

The QCS605 SoC also features Qualcomm® Noise and Echo Cancellation, as well as advanced on-device audio analytics and processing features to support natural language processing, audio speech recognition, and “barge-in” capability for a reliable voice interface even in loud or noisy environments or when users are far from the device.

Applications

• •  Household Robots
• •  Action/VR360 Cameras
• •  Enterprise Surveillance
• •  Smart Displays
• •  Dash/Body Cameras
• •  Digital Signage

Features and Benefits

• •  Dual 14-bit Qualcomm Spectra™ 270 ISP capable of supporting up to dual 16MP sensors
• •  Fabricated using the advanced 10nm FinFET process for exceptional thermal and power efficiency
• •  Qualcomm® Adreno™ 615 GPU with 64-bit addressing @ up to 780MHz with latest API support
• •  Qualcomm® Hexagon™ 685 DSP with dual hexagon vector extensions for running DNN models and advanced Qualcomm® Neural Processing SDK support
• •  Octa-core Qualcomm® Kryo™ 300 CPU optimized for power and DMIPS
• •  Qualcomm AI Engine designed to support on-device machine learning
• •  Low power sensor core helps support always-on use cases at reduced power levels
• •  Supports up to 2x2 802.11ac Wi-Fi with MU-MIMO and dual band simultaneous transmission, Bluetooth 5.1
• •  Support for high resolution 24-bit audio, with Qualcomm® aptX™ and aptX HD audio codecs, Qualcomm Aqstic™ audio codec
• •  HW based security designed with features such as secure boot from hardware root of trust, Qualcomm® Trusted Execution Environment, hardware crypto engines, storage security, debug security with lifecycle control, key provisioning and wireless protocol security

Related Products

QCS-605-0-771PSP-TR-01-0-AC

Chipset Components

Product	Part Numbers
QCS605 – Linux/Android	QCS-605
Power Management Module*	PM-670 + PMI-670L or PM-3003A
Charger	SMB-1355
Connectivity	WCN-3990
Audio Codec (Analog)	WCD-9340 or WCD-9341
Audio Speaker	WSA-8810 or WSA-8815
Location	SDR-660G

*Required

Please check part number accuracy before ordering.

Additional Notes

CPU	Kryo 300: 64-bit octa-cores, 2x Gold (2.5GHz) + 6x Silver (1.7GHz)
GPU	Adreno 615 @ up to 780MHz
Video	4K60 HEVC/H.264 + 1080P60 encode/ 4K60 10-bit: HEVC/VP9, HDR 10 decode
Display Support	1080p + 4K60
Wireless Connectivity	Integrated 2x2 802.11b/g/n/ac, Bluetooth v5.1
Camera Performance	32MP (2x ISP/16+16MP), 4K60 IQ improvement: MCTF, TNR, sHDR, EIS, Dewarp, Zoom
Camera Interface	CSI 4+4+4 lane (or 4+4+2+1), DPHY1.2, CPHY 1.0
DSP	Qualcomm AI Engine/ Hexagon 685 DSP w/ dual hexagon vector extensions
Audio Playback	Hi-Res/192kHz, Native 44.1kHz, audio on dedicated DSP
Location	GPS/GLONASS, BeiDou, Galileo
Memory	2x 16-bit LPDDR4.x @ 1866MHz
Storage	eMMC 5.1, UFS 2.1 Gear3 2-lane, SD 3.0
Peripherals	1x USB3.1
Package	10nm LPE, 10.5x11.1 mm2 non-PoP

Qualcomm QCS605, Qualcomm AI Engine, Qualcomm Noise and Echo Cancellation, Qualcomm Spectra, Qualcomm Hexagon, Qualcomm Adreno, Qualcomm Kryo, Qualcomm Neural Processing SDK, Qualcomm aptX, Qualcomm Trusted Execution Environment and Qualcomm Aqstic are products of Qualcomm Technologies, Inc. and/or its subsidiaries.