| EU RoHS | Compliant |
| ECCN (US) | 3A991b.1.a. |
| Part Status | Active |
| HTS | 8542.32.00.71 |
| Automotive | Yes |
| PPAP | Unknown |
| Cell Type | Managed NAND |
| Chip Density (bit) | 256G |
| Architecture | Sectored |
| Boot Block | Yes |
| Number of Bits/Word (bit) | 1/4/8 |
| Number of Words | 256G/64G/32G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Interface Type | Serial e-MMC |
| Maximum Operating Frequency (MHz) | 200 |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Operating Current (mA) | 37 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Supplier Temperature Grade | Automotive |
| Command Compatible | Yes |
| ECC Support | Yes |
| Mounting | Surface Mount |
| Package Height | 0.94 mm |
| Package Width | 14 mm |
| Package Length | 18 mm |
| PCB changed | 100 |
| Standard Package Name | BGA |
| Supplier Package | LBGA |
| Pin Count | 100 |
| Lead Shape | Ball |
