Micron TechnologyMT29RZ4C4DZZMGMF-18W.80CMulti-Chip Package Memory
4Gbit NAND and 4Gbit LPDDR2 168-Ball MCP
| Compliant | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| PCB changed | 168 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 168 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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