Samsung Electro-MechanicsCL10C100JB8NNNCCapacitor Ceramic Multilayer
Cap Ceramic 10pF 50V C0G 5% Pad SMD 0603 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| Automotive | No |
| PPAP | No |
| 10pF | |
| 5% | |
| 50VDC | |
| C0G | |
| Standard | |
| No | |
| Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 1.6 X 0.8 X 0.8 | |
| 0603 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.6 | |
| 0.8 | |
| 0.8 | |
| 0.0046 | |
| ±0.1 | |
| ±0.1 | |
| ±0.1 |
| EDA / CAD Models |
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