Digi InternationalCC-WMP157-KITEmbedded System Development Boards and Kits

Digi ConnectCore® MP157 is a compact, wireless and secure system- on-module based on the STMicroelectronics STM32MP157C MPU. With integrated 802.11ac Wi-Fi and Bluetooth® 5, it offers flexible connectivity. The tiny and reliable Digi SMTplus form factor (29x29mm) and standard industrial rating makes it ideal for creating rugged handheld devices, with display and 3D graphics support included.

The complete Linux BSP (Board Support Package) as well as the powerful Digi Embedded Yocto operating system and development environment make the ConnectCore® MP157 module the cornerstone of a complete ecosystem of hardware, software and solutions needed to quickly and successfully develop connected products.

The Kit Includes:

• •  Digi ConnectCore® MP157 development board with SOM
• •  Console port cable
• •  Dual-band wireless antenna
• •  Power supply and accessories
• •  Reference designs and online documentat

Key Features, Benefits and Applications

• •  Industrial-grade, scalable, embedded SOM platform
• •  Pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.0
• •  3D GPU, rich display and camera capabilities
• •  Power management with hardware and software support
• •  Digi SMTplus form factor (29 x 29 mm) for ultimate reliability
• •  High level of pin-compatibility with ConnectCore 6UL SOMs
• •  Built-in Digi TrustFence device security, identity and privacy
• •  Seamless cellular modem and Digi XBee® integration
• •  Digi ConnectCore Cloud Services remote monitoring, device management and IoT application enablement
• •  Digi Embedded Yocto Linux support
• •  Turnkey development services available from Digi WDS