NexperiaBUK7S1R5-40HJMOSFETs
Nexperia’s LFPAK88 delivers industry leading power density in truly innovative 8mm x 8mm footprint
Nexperia’s LFPAK88 MOSFET. Your choice for the most challenging designs
Driving Power-Density to the Next Level
Providing a true alternative to D2PAK, Nexperia’s LFPAK88 delivers industry leading power density in truly innovative 8mm x 8mm footprint. Delivering 2x higher continuous current rating, ultimate thermal performance and reliability, and up to 60% space saving efficiency, making LFPAK88 the MOSFET of choice for the most challenging new designs. Available in both automotive AEC-Q101 and industrial grades.
Applications
- • Power steering
- • ABS braking
- • DC/DC conversion
- • Reverse battery protection
- • Brushless DC motor power tools
- • Power supply equipment
- • Telecom infrastructure
Key Features
- • 8 mm x 8 mm footprint
- • 48 x power-density compared to wire bonded equivalents
- • Advanced package design exceeds 2 x AEC-Q101
- • Ultra low On-Resistance
- • Copper clip technology gives low electrical and thermal resistance
- • Best-in-class linear mode (SOA) performance in-rush and surge protection
Featured Articles & Videos
Related Searches
- 1. Copper-clip package
- 2. Power density
- 3. Space saving
- 4. Low RDSon & high ID
- 5. Brushless DC Motor efficiency
- 6. Peak thermal performance MOSFET
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| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8541.29.00.55 | |
| Automotive | Yes |
| PPAP | Unknown |
| Power MOSFET | |
| Single Triple Source | |
| Enhancement | |
| N | |
| 1 | |
| 40 | |
| 20 | |
| 260 | |
| 1.5@10V | |
| 67@10V | |
| 4794@25V | |
| 242000 | |
| 16 | |
| 12 | |
| 28 | |
| 16 | |
| -55 | |
| 175 | |
| Automotive | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 1.7(Max) |
| Package Width | 6.3(Max) |
| Package Length | 8.1(Max) |
| PCB changed | 4 |
| Tab | Tab |
| Standard Package Name | FPAK |
| Supplier Package | LFPAK |
| 5 | |
| Lead Shape | Gull-wing |
| EDA / CAD Models |
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