Analog DevicesAD9082BBPZ-4D2ACAnalog Front End - AFE
AFE General Purpose 2 ADC 12bit 1V/1.8V/2V 324-Pin TEBGA Tray
The transmit signal front end (MxFE™) is a highly integrated device with 16-bit, 12 GSPS maximum sample rate radio frequency (RF) digital-to-analog converter (DAC) core and 12-bit, 6 GSPS rate RF analog-to-digital (ADC) core. The AD9082, from Analog Devices, is able to support four transmitter channels and two receiver channels with 4D2A configuration.
This product is well suited for two- and four-antenna transmitter applications requiring wideband ADCs for the digital predistortion observation path. It features a 16-lane, 24.75 Gbps JESD204C or 15.5 Gbps JESD204B data transceiver port, an on-chip clock multiplier, and digital signal processing capability targeted at multiband direct-to-RF radio applications. It supports up to 6 GSPS complex transmit and receive data rates in single channel mode. The maximum radio band spacing supported in multichannel modes is 1.2 GHz.
The AD9082 features a bypassable interpolator and decimator for achieving ultrawideband capability along with low latency loop back and frequency hopping modes targeted at phase array radar system and electronic warfare jammer applications.
Key Features and Benefits
- • Flexible reconfigurable radio common platform design
- • AC performance target
- • Versatile Digital Features
- • RxAGC Support
- • Auxiliary Features
- • SERDES JESD204B/JESD204C interface, 16 lanes up to 24.75 Gbps
- • Target typical ~ 6 W to 7 W
- • 15 mm × 15 mm BGA with 0.8 mm pitch
Applications
- • Wireless communications infrastructure
- • W-CDMA, LTE, LTE-A, Massive-MIMO
- • Microwave point-to-point and E-Band and 5G mm Wave
- • Broadband communications systems
- • DOCSIS 3.0 CMTS
- • Phased array radar and electronic warfare
- • Electronic test and measurement systems
Block Diagrams and Tables

Related Evaluation Board
| Compliant | |
| 3A001a.5.a.3. | |
| Active | |
| 8542.39.00.30 | |
| Automotive | No |
| PPAP | No |
| General Purpose | |
| General Purpose | |
| 6 | |
| 2 | |
| 2 | |
| 12000000 | |
| 12 | |
| Serial (SPI) | |
| 0.95|1.7|1.9 | |
| 1|1.8|2 | |
| 1.05|2.1 | |
| 1.475Vp-p(Typ) | |
| Analog|Digital | |
| -40 | |
| 120 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.23 mm |
| Package Width | 15 mm |
| Package Length | 15 mm |
| PCB changed | 324 |
| Standard Package Name | BGA |
| Supplier Package | TEBGA |
| 324 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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