Molex714390864Connector Headers and PCB Receptacles

Other Part Names : 714390864

Mirror Mezz 15x11 OCP Connectors

Footprint-compatible, hermaphroditic Mirror Mezz 15x11 OCP Connector lowers application costs with stackable mating that supports data speeds up to 112 Gbps per differential pair, for telecommunications, networking and other applications.

Key Features:

Robust shrouded housing design

Encapsulates the pin field, protecting the pins and offering blind-mate guidance to eliminate any possibility of mis-mating

Stitched BGA design

Offers greater cost savings than insert-molded BGA attachments. Stitched contact structure reduces lead times and the connector design simplifies product matrix

Contact beam structure of a mated combination

Prevents vibrations and terminal lift to ensure a constant 2-points of contact for electrical reliability. Beam geometry offers reliable normal force for harsh environments and 1.50mm of nominal contact wipe to ensure sufficient engagement

Flex cable links

• Offer cost savings and excellent SI with controlled channels and pinned grounds
• Enable relaxed tolerancing for offsets between boards and flexible architectures

Intricate terminal structure design

Provides numerous mechanical strengths while also benefiting from cutting-edge electrical features, for some of the fastest speeds in the industry

Wide ground pins

Balance the electrical field and shield the differential pair from surrounding transmission lines

2 electrically tuned signal contacts

Cleanly transmit highspeed signals for maximum signal integrity surrounding transmission lines

Precise arranged combination of signals and grounds

Maximizes high-speed performance and clean routing out of the connector footprint, with precisely arranged and populated pin fields transmission lines

Different paddle-to-contact bend direction between the rows

Minimizes the cross-talk between rows

BGA attached and consistent ball profile

Leads to improved and Stitched contacts more predictable SI;

Stitched contacts

Provides lower costs and is more customizable than insert molding

Contact differences between rows; paddles have a bend direction to contact alternates

Minimizes crosstalk between rows (1.50mm-row pitch)

"Stubless" contact interface

Offers superior SI performance with minimum stack height of 5.00mm and two points of contact on every beam for reliability

 

APPLICATIONS

Data/Computing

Servers

Networking

Storage

Telecommunications/Networking

Infrastructure

Networking