Boyd Corporation374124B00035GHeat Sinks
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
| Compliant | |
| EAR99 | |
| Active | |
| 7616.99.51.90 | |
| Automotive | Unknown |
| PPAP | Unknown |
| Passive | |
| Aluminum | |
| 23.4 | |
| Pin Array | |
| BGA|FPGA | |
| Tape | |
| Black Anodized | |
| Adhesive | |
| 23 | |
| 23 | |
| 18 |
| EDA / CAD Models |
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