Winbond ElectronicsW66CP2NQUAHJDRAM 芯片
DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin WFBGA
| Compliant | |
| EAR99 | |
| LTB | |
| 8542.32.00.02 | |
| Automotive | No |
| PPAP | No |
| Mobile LPDDR4 SDRAM | |
| 4G | |
| 128Mx32 | |
| 8 | |
| 16M | |
| 32 | |
| 32 | |
| 4267 | |
| 3.5 | |
| 17 | |
| LVSTL | |
| 1.06|1.7 | |
| 1.17|1.95 | |
| 360 | |
| -40 | |
| 105 | |
| 32 | |
| Mounting | Surface Mount |
| Package Height | 0.72 |
| Package Width | 10 |
| Package Length | 14.5 |
| PCB changed | 200 |
| Standard Package Name | BGA |
| Supplier Package | WFBGA |
| 200 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.