Winbond ElectronicsW63AH2NBVADEDRAM 芯片
DRAM Chip Mobile LPDDR3 SDRAM 1Gbit 32Mx32 1.2V/1.8V 178-Pin VFBGA
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| Mobile LPDDR3 SDRAM | |
| 1G | |
| 32Mx32 | |
| 8 | |
| 4M | |
| 32 | |
| 32 | |
| 2133 | |
| 5.5 | |
| 16 | |
| HSUL_12 | |
| 1.7|1.14 | |
| 1.95|1.3 | |
| 215 | |
| -25 | |
| 85 | |
| 32 | |
| Mounting | Surface Mount |
| Package Height | 0.67 |
| Package Width | 11 |
| Package Length | 11.5 |
| PCB changed | 178 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 178 |
| EDA / CAD Models |
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