Winbond ElectronicsW6351G6KB-12DRAM 芯片
DRAM Chip DDR3 SDRAM 512Mbit 32Mx16 1.5V 96-Pin TFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.28 | |
| Automotive | No |
| PPAP | No |
| DDR3 SDRAM | |
| 512M | |
| 32Mx16 | |
| 8 | |
| 4M | |
| 16 | |
| 16 | |
| 1600 | |
| 0.225 | |
| 16 | |
| SSTL_15 | |
| 1.425 | |
| 1.575 | |
| 295 | |
| 0 | |
| 95 | |
| Commercial | |
| 16 | |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Width | 9 |
| Package Length | 13 |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| 96 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.