Winbond ElectronicsW632GU6NB11I/REELDRAM 芯片
DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V 96-Pin VFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| DDR3L SDRAM | |
| 2G | |
| 128Mx16 | |
| 8 | |
| 16M | |
| 16 | |
| 16 | |
| 933 | |
| 0.195 | |
| 17 | |
| 1.283 | |
| 1.45 | |
| 235 | |
| -40 | |
| 95 | |
| Industrial | |
| 16 | |
| Mounting | Surface Mount |
| Package Height | 0.6(Max) |
| Package Width | 7.5 |
| Package Length | 13 |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 96 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.