Winbond ElectronicsW25M321AVEITMulti-Chip Package Memory
MCP 4Mx8 NOR Flash + 128Mx8 NAND Flash 3V/3.3V 8-Pin WSON EP Tray
| Compliant | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 32M|1G | |
| 4Mx8 NOR Flash + 128Mx8 NAND Flash | |
| 7 | |
| Yes | |
| 2.7 | |
| 3.6 | |
| -40 | |
| 85 | |
| Industrial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.73 |
| Package Width | 8 |
| Package Length | 6 |
| PCB changed | 8 |
| Standard Package Name | SON |
| Supplier Package | WSON EP |
| 8 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.