Infineon Technologies AGSIGC156T60SNR2CX1SA1IGBT 芯片
Trans IGBT Chip N-CH 600V 200A 3-Pin Die Wafer
| Compliant | |
| EAR99 | |
| Obsolete | |
| EA | |
| Automotive | No |
| PPAP | No |
| N | |
| Single | |
| ±20 | |
| 600 | |
| 2 | |
| 200 | |
| 0.6 | |
| -55 | |
| 150 | |
| Wafer | |
| Package Height | 0.1 |
| Package Width | 12.5 |
| Package Length | 12.5 |
| PCB changed | 3 |
| Supplier Package | Die |
| 3 |
| EDA / CAD Models |
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