Infineon Technologies AGS25HL01GTDPBHI033Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 1G/512M/256M x 1/2-bit/4-bit 9ns 24-Pin BGA T/R
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 1G | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 256Kbyte x 512 | |
| 256byte|512byte | |
| 1/2/4 | |
| 1G/512M/256M | |
| Yes | |
| Synchronous | |
| 9 | |
| 1381/Chip | |
| 1.7/Page | |
| 45nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 69 | |
| 66 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| 2560000 | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 1(Max) - 0.2(Min) |
| Package Width | 8 |
| Package Length | 8 |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 24 |
| EDA / CAD Models |
Smarter Drone Systems from Concept to Deployment
Download the playbook and get equipped with powerful tools and smart strategies for designing agile, efficient, modular drone systems.