| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.90 |
| Automotive | No |
| PPAP | No |
| Driver Type | High Side|Low Side |
| Driver Configuration | Inverting|Non-Inverting |
| Bridge Type | Half Bridge |
| Number of Drivers | 2 |
| High and Low Sides Dependency | Independent |
| Type | GaNFET|MOSFET |
| Number of Outputs | 2 |
| Maximum Rise Time (ns) | 7(Typ) |
| Maximum Fall Time (ns) | 3.5(Typ) |
| Maximum Propagation Delay Time (ns) | 35(Typ) |
| Input Logic Compatibility | TTL |
| Minimum Operating Supply Voltage (V) | 4.5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Supply Current (mA) | 2(Typ) |
| Peak Output Current (A) | 5(Typ) |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Special Features | Under Voltage Lockout |
| Maximum Turn-On Delay Time (ns) | 1.5(Typ) |
| Maximum Turn-Off Delay Time (ns) | 1.5(Typ) |
| Latch-Up Proof | No |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.47(Max) |
| Package Width | 1.76(Max) |
| Package Length | 1.91(Max) |
| PCB changed | 12 |
| Standard Package Name | BGA |
| Supplier Package | DSBGA |
| Pin Count | 12 |
| Lead Shape | Ball |
